低電力DC/DCコンバータ用の3Dパワーパッケージング。

The RPX series in an ultra-compact QFN package is widely used as a Point-of-Load regulator for loads requiring supply voltages down to 0.8V such as CPUs, GPUs and SoC devices, with their exacting regulation and noise requirements. At the same time, high efficiency is required for cool running in space and weight critical applications such as portable devices. In other applications such as industrial, the wide input range provides useful safety headroom when transients are present. Traditionally, low losses have been achieved by utilizing low switching frequencies. However, RECOM technology, along with advances in semiconductors and magnetic materials allow operation in the MHz region with good efficiency to allow micro-miniaturization.

The RPX series has a footprint of just 3mm x 5mm x 1.6mm for the 1A and 1.5A versions, 4.5mm x 4mm x 2mm for the 2.5A version and 5mm x 5.5mm x 4.1mm for the 4A variant which has a peak efficiency of over 90%. High power density is achieved with a low-cost flip-chip on leadframe and integrated-inductor construction with over-molding. This gives the added benefits of tight switching current loops generating very low EMI, along with high power density and optimized thermal performance, all in a QFN package. Astonishing ‘3D Power Packaging’ performance that cannot be matched by a discrete solution.