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Increase your power density with 3DPP®
Low power switching regulators and isolated DC/DC converters need to be cost-effective, despite ever-increasing demands for better electrical performance and improved power density. Manufacturers have responded over time with many form-factors that help with economical manufacturing, often with a minimal component count with transformers and inductors hand-soldered to traditional PCBs resulting in performance and manufacturing compromises. To minimize the PCB footprint, through-hole SIP versions are often used, though they can complicate the assembly, requiring mixing of wave, or even hand soldering with the reflow process for the other SMT components used on the board.
Table of Contents
- Non-Isolated Power Modules
- RPH-3.0 - Integrated Inductor DC/DC Power Modules
- RPM, RPMB, RPMH - Non isolated LGA Power Modules
- RPX/RPY - Non isolated QFN Power Modules
- RPL - Integrated Inductor DC/DC Power Modules
- RPZ - Integrated Inductor DC/DC Power Modules
- R-78AA-1.0 – SMT switching regulator "78xx" series linear regulator replacement
- ROF-78E - Open frame switching regulator
- Isolated DC/DC Converter
Increase your power density with 3D Power Packaging®
Although millions of this style of through-hole DC/DC converter are sold each year, a long-term goal for RECOM has been to develop versions which can be manufactured efficiently and repeatably and can be handled, placed and soldered like any other modern SMT component. Electrical performance should be enhanced and the parts should have a low profile to match today’s slim-line products. However, the footprint must still remain small to realize the advantages of a module over a discrete design. To achieve this, switching regulators and isolated DC/DC converter modules have to utilize the Z direction by integrating 3D packaging and assembly techniques.
RPM internal PCB visualization
The innovative, state of the art manufacturing technologies that RECOM has developed are complemented by advanced circuit and thermal design resulting in highly efficient parts, achieving astonishing power levels at high temperatures, in packages compatible with high speed machine automation for handling placement and soldering. An example is the QFN-packaged RPX series, just 3mm x 5mm x 1.6mm for versions providing 1A and 1.5A output at a programmable voltage from 0.8-30VDC.
While non-isolated DC/DC converters shrink in size as technology advances, isolated parts are restricted by practical and statutory creepage and clearance distances. This gives a minimum footprint size, but RECOM has applied 3D Power Packaging innovation to reduce the height to an absolute minimum. For example, the SOIC-16 RxxCxx series includes the stringent 2MOPP/250VAC medical grade isolation but is just 2.65mm profile.
RECOM parts incorporating 3D Power Packaging technology are ideal for space- and cost-critical applications in industrial, medical, networks, storage, portable equipment, imaging systems, telecoms and ‘Point-of-Load’ power for processors and FPGAs.
RECOM has coined the term 3D Power Packaging® techniques now developed to achieve the goal of truly ’SMT Component’ style DC/DC converters. These now can be classified as hi-tech ‘Power Packages’ or ‘Power Modules’ that users cannot hope to replicate as discrete designs on their boards, any more than they would try to replace a processor with a discrete design.
Techniques utilized in the 3D Power Packaging concept include integrated magnetics, control ICs embedded in multilayer substrates with buried and blind vias, flip-chip mounting of the IC and leadframe technology. SMD termination technologies include QFN, SSOP and LGA as well as traditional gull-wing.
Techniques utilized in the 3D Power Packaging concept include integrated magnetics, control ICs embedded in multilayer substrates with buried and blind vias, flip-chip mounting of the IC and leadframe technology. SMD termination technologies include QFN, SSOP and LGA as well as traditional gull-wing.
RPM internal PCB visualization
The innovative, state of the art manufacturing technologies that RECOM has developed are complemented by advanced circuit and thermal design resulting in highly efficient parts, achieving astonishing power levels at high temperatures, in packages compatible with high speed machine automation for handling placement and soldering. An example is the QFN-packaged RPX series, just 3mm x 5mm x 1.6mm for versions providing 1A and 1.5A output at a programmable voltage from 0.8-30VDC.
While non-isolated DC/DC converters shrink in size as technology advances, isolated parts are restricted by practical and statutory creepage and clearance distances. This gives a minimum footprint size, but RECOM has applied 3D Power Packaging innovation to reduce the height to an absolute minimum. For example, the SOIC-16 RxxCxx series includes the stringent 2MOPP/250VAC medical grade isolation but is just 2.65mm profile.
RECOM parts incorporating 3D Power Packaging technology are ideal for space- and cost-critical applications in industrial, medical, networks, storage, portable equipment, imaging systems, telecoms and ‘Point-of-Load’ power for processors and FPGAs.
Non-Isolated Power Modules
RPH-3.0 - Integrated Inductor DC/DC Power Modules
The RECOM RPH-3.0 is a compact 3A power module, encapsulated within a space-saving 10 x 12 x 4mm QFN SMD package. Embodying RECOM’s '3D Power Packaging' philosophy, this module integrates a shielded inductor and employs flip-chip mounting for its control IC, ensuring superior electrical and thermal efficiency. This module boasts a very wide input voltage range from 4.5V to 55V DC, accommodating power sources such as 36V or 48V li-Ion batteries or 5V, 12V, 24V, or 48V power supply rails.
- Buck regulator power module with integrated shielded inductor
- 4.5-55VDC input
- Programmable 1 - 15V output voltage
- 3A maximum output current
- SCP, OCP, OVP and UVLO protection
- 10mm x 12mm x 4mm QFN package
- Flip-Chip technology for improved thermal management
- Efficiency up to 91%
- Operating temperature to 125°C with derating
- Programmable operating frequency 100kHz to 1MHz
- Signals and control – PGOOD, ON/OFF
| Series | Current (A) | Vin (V) | Main Vout (V) | Mounting Type | Package Style | |||
|---|---|---|---|---|---|---|---|---|
| 1 |
|
RPH-3.0
Focus
New
| 3.0 | 4.5 - 55.0 | 1 to 15 | SMD (pinless) | 47-Pin QFN, 47-Pad QFN | |
| 2 |
|
RPH-3.0-EVM-1
Focus
New
| 3.0 | 4.5 - 55.0 | 1 to 15 | Open Frame |
RPM, RPMB, RPMH - Non isolated LGA Power Modules
The RECOM RPMB/RPMH high-power switching regulators are presented in a low-profile, thermally-enhanced and shielded 25-pad LGA package, 11.7mm x 12.19mm x 3.75mm high. Construction leverages RECOM’s ‘3D Power Packaging’ philosophy with a four-layer PCB with plugged and blind vias for good thermal management and high power density. With just 1.4cm2 of board area around the module, full power can be delivered up to at least 85°C with no forced air achieving 800W/in3 up to 90°C.
- High power density
- Low profile
- 0.5A, 1A, 1.5A, 2A, 3A, & 6A output current
- 4-65VDC input
- Adjustable output up to 28VDC
- Up to 99% efficiency, no need for heatsinks
- 6-sided shield for low EMI
- Wide operating temperature from -40°C up to +107°C at full load
- For battery-powered equipment, telecom, FPGA, or POL applications
- Fully-protected with SCP, OCP, OTP, & UVLO
- No external components required
- Compact industry standard footprint
- Made in Europe
There are four RPM series available, all with identical pad designs so that they are interchangeable:
| Series | Current (A) | Vin (V) | Main Vout (V) | Mounting Type | Package Style | |||
|---|---|---|---|---|---|---|---|---|
| 1 |
|
RPM-1.0
Focus
| 1.0 | 3.0 - 17.0 | 0.9 to 6 | SMD (pinless) | 25 pad LGA | |
| 2 |
|
RPM-2.0
Focus
| 2.0 | 3.0 - 17.0 | 0.9 to 6 | SMD (pinless) | 25 pad LGA | |
| 3 |
|
RPM-3.0
Focus
| 3.0 | 3.0 - 17.0 | 0.9 to 6 | SMD (pinless) | 25 pad LGA | |
| 4 |
|
RPM-6.0
Focus
| 6.0 | 4.0 - 15.0 | 0.9 to 6 | SMD (pinless) | 25 pad LGA | |
| 5 |
|
RPM-1.0-EVM-1
| 1.0 | 3.0 - 17.0 | 0.9 to 6 | Open Frame | ||
| 6 |
|
RPM-2.0-EVM-1
| 2.0 | 3.0 - 17.0 | 0.9 to 6 | Open Frame | ||
| 7 |
|
RPM-3.0-EVM-1
| 3.0 | 3.0 - 17.0 | 0.9 to 6 | Open Frame | ||
| 8 |
|
RPM-6.0-EVM-1
| 6.0 | 4.0 - 15.0 | 0.9 to 6 | Open Frame |
| Series | Current (A) | Vin (V) | Trim Pin Output Voltage Adjustment | Mounting Type | Package Style | |||
|---|---|---|---|---|---|---|---|---|
| 1 |
|
RPMB-2.0
Focus
| 2.0 | 4.0 - 36.0, 5.5 - 36.0, 12.8 - 36.0, 16.0 - 36.0 | 1-9, 9-24 | SMD (pinless) | 25 pad LGA | |
| 2 |
|
RPMB-3.0
Focus
| 3.0 | 4.0 - 36.0, 5.5 - 36.0, 12.8 - 36.0, 16.0 - 36.0 | 1-9, 9-24 | SMD (pinless) | 25 pad LGA | |
| 3 |
|
RPMB-2.0-EVM-1
| 2.0 | 4.0 - 36.0, 5.5 - 36.0, 12.8 - 36.0, 16.0 - 36.0 | 1-9, 9-24 | Open Frame | ||
| 4 |
|
RPMB-3.0-EVM-1
| 3.0 | 4.0 - 36.0, 5.5 - 36.0, 12.8 - 36.0, 16.0 - 36.0 | 1-9, 9-24 | Open Frame |
| Series | Current (A) | Vin (V) | Main Vout (V) | Mounting Type | Package Style | |||
|---|---|---|---|---|---|---|---|---|
| 1 |
|
RPMH-0.5
Focus
| 0.5 | 4.3 - 65.0, 6.0 - 65.0, 13.5 - 65.0, 16.5 - 65.0, 25.5 - 65.0 | 15 to 28, 2.64 to 3.63, 4 to 5.5, 7.2 to 13.2, 9 to 16.5 | SMD (pinless) | 25 pad LGA | |
| 2 |
|
RPMH-1.5
Focus
| 1.5 | 5.0 - 60.0, 7.0 - 60.0, 14.0 - 60.0, 17.0 - 60.0, 26.0 - 60.0 | 15 to 28, 2.64 to 3.63, 4 to 5.5, 7.2 to 13.2, 9 to 16.5 | SMD (pinless) | 25 pad LGA | |
| 3 |
|
RPMH-0.5-EVM-1
| 0.5 | 4.3 - 65.0, 6.0 - 65.0, 13.5 - 65.0, 16.5 - 65.0, 25.5 - 65.0 | 15 to 28, 2.64 to 3.63, 4 to 5.5, 7.2 to 13.2, 9 to 16.5 | Open Frame | ||
| 4 |
|
RPMH-1.5-EVM-1
| 1.5 | 5.0 - 60.0, 7.0 - 60.0, 14.0 - 60.0, 17.0 - 60.0, 26.0 - 60.0 | 15 to 28, 2.64 to 3.63, 4 to 5.5, 7.2 to 13.2, 9 to 16.5 | Open Frame |
RPX/RPY - Non isolated QFN Power Modules
The RPX series in an ultra-compact QFN package is widely used as a Point-of-Load regulator for loads requiring supply voltages down to 0.8V such as CPUs, GPUs and SoC devices, with their exacting regulation and noise requirements. At the same time, high efficiency is required for cool running in space and weight critical applications such as portable devices. In other applications such as industrial, the wide input range provides useful safety headroom when transients are present. Traditionally, low losses have been achieved by utilizing low switching frequencies. However, RECOM technology, along with advances in semiconductors and magnetic materials allow operation in the MHz region with good efficiency to allow micro-miniaturization.
The RPX series has a footprint of just 3mm x 5mm x 1.6mm for the 1A and 1.5A versions, 4.5mm x 4mm x 2mm for the 2.5A version and 5mm x 5.5mm x 4.1mm for the 4A variant which has a peak efficiency of over 90%. High power density is achieved with a low-cost flip-chip on leadframe and integrated-inductor construction with over-molding. This gives the added benefits of tight switching current loops generating very low EMI, along with high power density and optimized thermal performance, all in a QFN package. Astonishing ‘3D Power Packaging’ performance that cannot be matched by a discrete solution.
The RPX series has a footprint of just 3mm x 5mm x 1.6mm for the 1A and 1.5A versions, 4.5mm x 4mm x 2mm for the 2.5A version and 5mm x 5.5mm x 4.1mm for the 4A variant which has a peak efficiency of over 90%. High power density is achieved with a low-cost flip-chip on leadframe and integrated-inductor construction with over-molding. This gives the added benefits of tight switching current loops generating very low EMI, along with high power density and optimized thermal performance, all in a QFN package. Astonishing ‘3D Power Packaging’ performance that cannot be matched by a discrete solution.
The RPY series is intended for programmable constant current applications, up to 1.5A, ideal for driving high power LEDs. The QFN package is just 3mm x 5mm x 1.6mm high.
The RPX-Q and RPY-Q variants are also qualified to the automotive standard AEC-Q100, to +125°C, including optional ‘wettable’ flanks for automated optical inspection of solder joints.
The RPX-Q and RPY-Q variants are also qualified to the automotive standard AEC-Q100, to +125°C, including optional ‘wettable’ flanks for automated optical inspection of solder joints.
- Constant voltage with 1A, 1.5A, 2.5 & 4A output current (RPX, RPX-Q)
- Constant current max 1.5A (RPY-Q)
- 3.8-36VDC input
- Adjustable output voltage 0.8-30VDC (RPX, RPX-Q)
- Adjustable output current 0-100% (RPY-Q)
- Reliable operation to over 110°C
- -Q versions are AEC-Q100 automotive qualified to +125°C
- Overmolded leadframe technology with substrate-embedded control IC
- Integrated FETs, inductors, and passives for simple design
- Excellent thermal performance for the harshest application demands
- Fully-protected with SCP, OCP, OTP, & UVLO
- ON/OFF control
- Minimal filtering required for Class A or B EMC
| Series | Current (A) | Vin (V) | Main Vout (V) | Mounting Type | Package Style | |||
|---|---|---|---|---|---|---|---|---|
| 1 |
|
RPX-0.5Q
Focus
| 0.5 | 4.0 - 36.0 | 0.8 to 34 | SMD (pinless) | QFN | |
| 2 |
|
RPX-1.0
Focus
| 1.0 | 4.0 - 36.0 | 0.8 to 30 | SMD (pinless) | QFN | |
| 3 |
|
RPX-1.5
Focus
| 1.5 | 4.0 - 36.0 | 0.8 to 30 | SMD (pinless) | QFN | |
| 4 |
|
RPX-1.5Q
Focus
| 1.5 | 4.0 - 36.0 | 0.8 to 30 | SMD (pinless) | QFN | |
| 5 |
|
RPX-2.5
Focus
| 2.5 | 4.5 - 28.0 | 1.2 to 6 | SMD (pinless) | QFN | |
| 6 |
|
RPX-4.0
Focus
| 4.0 | 3.8 - 36.0 | 1 to 7 | SMD (pinless) | QFN | |
| 7 |
|
RPX-4.0-EVM-1
Focus
| 4.0 | 4.0 - 36.0 | 1 to 7 | Open Frame | ||
| 8 |
|
RPX-1.0-EVM-1
| 1.0 | 4.0 - 36.0 | 0.8 to 30 | Open Frame | ||
| 9 |
|
RPX-1.5-EVM-1
| 1.5 | 4.0 - 36.0 | 0.8 to 30 | Open Frame | ||
| 10 |
|
RPX-2.5-EVM-1
| 2.5 | 4.5 - 28.0 | 1.2 to 6 | Open Frame |
| Series | Current (A) | Vin (V) | Main Vout (V) | Mounting Type | Package Style | |||
|---|---|---|---|---|---|---|---|---|
| 1 |
|
RPY-1.5Q
Focus
| 1.5 | 4.0 - 36.0 | 0.8 to 34.8 | SMD (pinless) | QFN | |
| 2 |
|
RPY-1.5Q-EVM-1
Focus
| 1.5 | 4.0 - 36.0 | 0.8 to 34.8 | Open Frame |
RPX: Ultra compact QFN-package power modules
RPL - Integrated Inductor non-isolated Power Modules
The RPL series of power modules rated at 1A, 3A, 5A, 10A and 20A(peak) utilize RECOMS’s ‘3D-Power Packaging’ technology to achieve class-leading, extreme power density. Needing just input and output capacitors and voltage setting resistors, the parts are fully featured with control and protection functions. This includes remote sensing for parts rated at 3A and 5A and ON/OFF control and power good signaling for all modules. An internal LDO regulator provides a fixed 3.3 VDC/20mA output suitable for pull-ups or external control logic.
The RPL-10 and RPL-20 feature enable, tracking and power good connections to permit simple power rail sequencing in distributed power architecture applications, as well as adjustable operating frequency and start-up times. The RPL series uses constant on-time control for a fast reaction to abrupt load transients combined with a separate slow control loop for output stability, offering precise load regulation without compromise. This makes the parts ideal for powering dynamic loads such as microcontrollers, radios, or pulsed current imaging systems. Operating frequency is programmable.
The RPL-10 and RPL-20 feature enable, tracking and power good connections to permit simple power rail sequencing in distributed power architecture applications, as well as adjustable operating frequency and start-up times. The RPL series uses constant on-time control for a fast reaction to abrupt load transients combined with a separate slow control loop for output stability, offering precise load regulation without compromise. This makes the parts ideal for powering dynamic loads such as microcontrollers, radios, or pulsed current imaging systems. Operating frequency is programmable.
- 1A, 3A, 5A, 10A or 20A rating
- Tiny 3mm x 3mm x 1.45mm size (1A to 5A versions) or 7mm x 7mm (10A and 20A versions)
- Adjustable output down to 0.6VDC, up to 12VDC
- Wide input voltage range from 2.75VDC to 22V (variant dependent), covering 5, 12 or 15 VDC supply rails or battery-powered supplies
- Up to 96% efficiency (50% load)
- Wide operating temperature range (-40°C up to +120°C)
- Fully protected with SCP, OCP, OVP & OTP
- Enable and power-good pins for simple power rail sequencing
- Meets EN 55032 EMC limits with simple LC filter components
- For distributed power architecture, portable equipment, imaging systems and industrial applications
| Series | Iout 1 (mA) | Vin (V) | Main Vout (V) | Mounting Type | Package Style | |||
|---|---|---|---|---|---|---|---|---|
| 1 |
|
RPL-1.0
Focus
New
| 1000.0 | 3.0 - 22.0 | 0.6 to 12 | SMD (pinless) | 11 pad LGA | |
| 2 |
|
RPL-1.0-EVM-1
Focus
New
| 1000.0 | 3.0 - 22.0 | 0.6 to 12 | Open Frame | ||
| 3 |
|
RPL-10
Focus
New
| 10000.0 | 4.0 - 16.0 | 0.6 to 5.5 | SMD (pinless) | 29 pad LGA | |
| 4 |
|
RPL-10-EVM-1
Focus
New
| 10000.0 | 4.0 - 16.0 | 0.6 to 5.5 | Open Frame | ||
| 5 |
|
RPL-20
Focus
New
| 20000.0 | 4.0 - 16.0 | 0.6 to 5.5 | SMD (pinless) | 29 pad LGA | |
| 6 |
|
RPL-20-EVM-1
Focus
New
| 20000.0 | 4.0 - 16.0 | 0.6 to 5.5 | Open Frame | ||
| 7 |
|
RPL-3.0
Focus
| 3000.0 | 4.0 - 18.0 | 0.8 to 5.2 | SMD (pinless) | 10 pad LGA | |
| 8 |
|
RPL-5.0
Focus
New
| 5000.0 | 2.75 - 17.0 | 0.6 to 12 | SMD (pinless) | 24-Pad QFN | |
| 9 |
|
RPL-5.0-EVM-1
Focus
New
| 5000.0 | 2.75 - 17.0 | 0.6 to 12 | Open Frame |
RPZ - Integrated Inductor non-isolated QFN Power Modules
The RPZ series is optimized for operation from fixed 3.3VDC, 5VDC or from a single Li-ion cell input. Parts rated at 0.5A and 1A are in a tiny package just 2mm x 2mm footprint, 2A and 3A rated parts are 2.5mm x 3.5mm and 6A parts are 4mm x 6mm footprint. The series uses thermally enhanced ‘3D-Power Packaging’ technology for an operating temperature up to more than +100°C without forced air cooling.
An innovative constant-on-time, dual speed control loop eliminates the delay due to an internal compensation network and permits ultra-fast voltage regulation with transient loads. This makes the parts especially suitable for powering dynamic loads such as microcontrollers, radios or pulsed current imaging systems. Conversion efficiency is up to 92% enabling class-leading power density.
Just input/output capacitors and voltage setting resistors are needed for a complete regulator solution with full protection and control features including programmable under voltage lock-out to prevent battery input over-discharge. In shutdown, current consumption reduces to microamp levels.
An innovative constant-on-time, dual speed control loop eliminates the delay due to an internal compensation network and permits ultra-fast voltage regulation with transient loads. This makes the parts especially suitable for powering dynamic loads such as microcontrollers, radios or pulsed current imaging systems. Conversion efficiency is up to 92% enabling class-leading power density.
Just input/output capacitors and voltage setting resistors are needed for a complete regulator solution with full protection and control features including programmable under voltage lock-out to prevent battery input over-discharge. In shutdown, current consumption reduces to microamp levels.
- 0.5A to 6A non-isolated SMD power modules
- QFN packages
- Adjustable output from 0.6V up to 6.65 VDC (RPZ-6.0)
- Wide 2.75-7 VDC input covering 3.3 or 5 rails or battery-powered supplies (RPZ-6.0)
- Up to 92% efficiency
- Wide operating temperature range (-40°C up to +110°C)
- Fully protected with SCP, OCP, OVP & OTP
- Enable and power-good pins for simple power rail sequencing
- Meets EN55032 EMC limits with simple LC filter components
- For distributed power architecture, FPGA, ASIC or microcontroller
- Point-of-Load supplies, portable equipment, imaging systems and industrial applications
| Series | Current (A) | Vin (V) | Main Vout (V) | Mounting Type | Package Style | |||
|---|---|---|---|---|---|---|---|---|
| 1 |
|
RPZ-0.5
Focus
New
| 0.5 | 2.3 - 5.5 | 0.6 to 5.375 | SMD (pinless) | 10-Pad QFN | |
| 2 |
|
RPZ-0.5-EVM-1
Focus
New
| 0.5 | 2.3 - 5.5 | 0.6 to 5.375 | Open Frame | ||
| 3 |
|
RPZ-1.0
Focus
New
| 1.0 | 2.3 - 5.5 | 0.6 to 5.25 | SMD (pinless) | 10-Pad QFN | |
| 4 |
|
RPZ-1.0-EVM-1
Focus
New
| 1.0 | 2.3 - 5.5 | 0.6 to 5.25 | Open Frame | ||
| 5 |
|
RPZ-2.0
Focus
New
| 2.0 | 2.75 - 6.0 | 0.6 to 5.74 | SMD (pinless) | 18-Pad QFN | |
| 6 |
|
RPZ-2.0-EVM-1
Focus
New
| 2.0 | 2.75 - 6.0 | 0.6 to 5.74 | Open Frame | ||
| 7 |
|
RPZ-3.0A
Focus
New
| 3.0 | 2.75 - 6.0 | 0.6 to 5.5 | SMD (pinless) | 18-Pad QFN | |
| 8 |
|
RPZ-3.0A-EVM-1
Focus
New
| 3.0 | 2.75 - 6.0 | 0.6 to 5.5 | Open Frame | ||
| 9 |
|
RPZ-6.0
Focus
New
| 6.0 | 2.75 - 7.0 | 0.6 to 6.65 | SMD (pinless) | 24-Pad QFN | |
| 10 |
|
RPZ-6.0-EVM-1
Focus
New
| 6.0 | 2.75 - 7.0 | 0.6 to 6.65 | Open Frame |
R-78 and ROF-78E high efficiency three terminal linear regulator replacements
Over many years, high-efficiency switching converter replacements for the traditional ‘78xx series’ linear regulators have been released. Although ‘drop-in’ through-hole equivalent parts have been popular, surface-mount types are now preferred.
As one of the first manufacturers to make a switching regulator module, RECOM first addressed the market with an encapsulated ‘gull-wing’ 1A-rated part, the R-78AA-1.0 series, which has a wide input range of up to 18V, allowing 5V, 9V, 12V or 15V unregulated supplies to be used, and fixed regulated outputs of 1.5V,1.8V, 2.5V or 3.3V, in a volume of just 1.75cm3. For applications where a low-profile open-frame product was preferred, the RECOM ROF-78E series offered 0.5A rating with a wider input range of up to 36V and fixed output voltages of 3.3V, 5V or 12V in a total volume of 0.68cm3.
As one of the first manufacturers to make a switching regulator module, RECOM first addressed the market with an encapsulated ‘gull-wing’ 1A-rated part, the R-78AA-1.0 series, which has a wide input range of up to 18V, allowing 5V, 9V, 12V or 15V unregulated supplies to be used, and fixed regulated outputs of 1.5V,1.8V, 2.5V or 3.3V, in a volume of just 1.75cm3. For applications where a low-profile open-frame product was preferred, the RECOM ROF-78E series offered 0.5A rating with a wider input range of up to 36V and fixed output voltages of 3.3V, 5V or 12V in a total volume of 0.68cm3.
Isolated DC/DC Converters
When safety agency certified isolation is required, besides voltage withstand, minimum creepage and clearance distances are defined. For example, in medical applications with mains system voltages, 8mm creepage is required between input and output for two Measures of Patient Protection (2MOPP). Given this minimum packaging dimension, a more traditional approach can be taken, with an internal die comprised of a power chiplet and control chiplet wire-bonded to a DVE SOIC-16 leadframe, then conventionally over-molded, such as in the RECOM RxxCT(E) and RxxC05TE parts. The transformer in these DC/DC converters is a proprietary, very low profile, planar-type design, achieving up to 5kVAC/1min isolation voltage and reinforced, 2MOPP isolation. The overall height of these parts is only 2.50-2.65mm, making them suitable for card-type applications as the height of the isolated DC/DC converter is not higher than the other typical SMT components.
RS12-Z - 12W isolated and regulated DC/DC Converters SIP format
The RS12-Z series of DC/DC converters achieves class-leading power density in a SIP8 format by leveraging planar transformer technology with advanced packaging and thermal design. In a metal case, the series features high efficiency and operates at full 12W load to +75°C with convection cooling only (24V input). Pinout is industry standard with backwards-compatibility to 3W and 6W parts in the SIP8 format, for an easy power upgrade. Minimal external filtering is required to achieve EN 55032 EMC compliance, class A or B. The parts also include an output trim function and input under voltage lockout as well as continuous short circuit protection.
The parts are ideal when a wide input range is required, covering multiple nominal voltages.
The parts are ideal when a wide input range is required, covering multiple nominal voltages.
- 12W in a SIP8 package
- 3kVDC functional isolation
- Fully regulated
- 4:1 input 9-36V or 18-75V
- Wide choice of output voltages
- High operating temperature
- On/off control
- Output trim
- Short circuit protection
- Safety agency certified
| Series | Power (W) | Vin (V) | Main Vout (V) | Mounting Type | Package Style | |||
|---|---|---|---|---|---|---|---|---|
| 1 |
|
RS12-Z
Focus
| 12.0 | 9.0 - 36.0, 18.0 - 75.0 | 10.8 to 13.2, 13.5 to 16.5, 2.97 to 3.63, 21.6 to 26.4, 4.5 to 5.5 | THT | SIP8 |
R1SX, R2SX, R1DX, R1ZX - Surface-mount isolated DC/DC Converters
These DC/DC converters feature the unique RECOM ‘3D packaging technology’. A custom plastic molding supports the control PCB which forms the top surface of the part, while the isolation transformer mounts underneath, to achieve a minimum footprint overall, with a height between 5.8 and 8.5mm depending on family. The open-frame construction has particular value when surface-mount reflow profiles are too severe for potted or molded parts. The R1SX series provides a single output at 1W up to +100°C while the R1DX provides dual outputs. Both parts are agency-certified with 3kV/1 second isolation. The R1ZX series is similar to the R1SX but includes a linear regulator for a precise, low noise output with 2kV/1 second isolation. The R2SX series provides 2W up to +75°C (+100°C with derating) and withstands 3kV/1 second.
All devices in this packaging format have industry standard and compatible pin-outs and are ideal for use in bus isolators, industrial controls and battery management systems.
All devices in this packaging format have industry standard and compatible pin-outs and are ideal for use in bus isolators, industrial controls and battery management systems.
- Industry standard surface-mount pin-out, common across the family
- Selection of input and output voltages
- Dual outputs available (R1DX)
- Isolation up to 3kV/1 second (2kV R1ZX)
- High efficiency
- No minimum load requirement
- 1W output over a wide temperature range (R1SX, R1DX, R1ZX)
- 2W output (R2SX)
- Ideal for communication interface power isolation and general use
- Safety agency certified
RxxCT(E), RxxC05TE, RxxC1FxxS and RxxC2Txx - Isolated SOIC-16 DC/DC Converters
The R05CT05S part offers a line and load regulated output with an external enable, operates from -40°C up to +140°C, delivers 500mW from a 5V input with selectable 5V or 3.3V outputs and is particularly suitable for powering isolated interfaces in medical and industrial applications as it is IEC/EN 60601-1 and IEC/EN 62388-1 compliant.
The R05CTE05S part is a lower cost alternative with a semi-regulated 5V output and basic isolation (3kVDC/1min) and operating range (-40°C up to +125°C). However, it delivers double the power (1000mW) from a 5V input, and its automated manufacture makes it particularly suitable for powering isolated interfaces in high reliability industrial applications. It is IEC/EN 62388-1 compliant.
The R05C05TE05S part is a very cost effective alternative with a semi-regulated 5V output and basic isolation (3kVDC/1min) and operating range (-40°C up to +125°C). It delivers 500mW (600mW peak) from a 5V input, and its automated manufacture makes it particularly suitable for powering isolated interfaces in high reliability industrial applications. It is IEC/EN 62388-1 compliant.
The isolated SMD DC/DC converter RxxC1TFxxS comes in an ultra-compact 5mm x 4mm x 1.2mm LGA package. The input voltage range covers both 3.3V and 5V rails and the regulated and protected output is pin selectable for 3.3V or 5V. The part offers 3kVAC/1s isolation, and a wide operating temperature range from -40°C up to +80°C without derating. The fully automated manufacture makes it particularly suitable for high-reliability industrial applications, such as isolated communication ports, industrial automation, IoT applications, and sensor isolation.
The unique programmable regulated output converter RxxC2Txx allows gate driver circuit designers to optimize existing circuits and to future-proof their designs. The positive and negative outputs can be independently set with simple resistor dividers within the range of +2.5V to +22.5V and from -2.5V to -22.5V, as long as the total output voltage lies above 18V and below 25V. For example, gate driver supply voltages of +20/-5V, +18/-9V, +/-12V, +18/-4V, or +15/-3V can all be generated using just this one part.
The RxxC2Txx offers 3kVAC/1min isolation, and a wide operating temperature range from -40°C up to +100°C with 1.5W load. The low isolation capacitance of 3.5pF and the high 150kV/µs CMTI makes this part ideal for IGBT, Si-MOSFET, SiC, or cascode GaN isolated gate driver power supplies.
The RxxCT(E) and RxxC05TE series are available in cut-tape (-CT) or tape-and-reel (-R) packaging options.
The unique programmable regulated output converter RxxC2Txx allows gate driver circuit designers to optimize existing circuits and to future-proof their designs. The positive and negative outputs can be independently set with simple resistor dividers within the range of +2.5V to +22.5V and from -2.5V to -22.5V, as long as the total output voltage lies above 18V and below 25V. For example, gate driver supply voltages of +20/-5V, +18/-9V, +/-12V, +18/-4V, or +15/-3V can all be generated using just this one part.
The RxxC2Txx offers 3kVAC/1min isolation, and a wide operating temperature range from -40°C up to +100°C with 1.5W load. The low isolation capacitance of 3.5pF and the high 150kV/µs CMTI makes this part ideal for IGBT, Si-MOSFET, SiC, or cascode GaN isolated gate driver power supplies.
The RxxCT(E) and RxxC05TE series are available in cut-tape (-CT) or tape-and-reel (-R) packaging options.
- Post regulated 0.5W and 1W
- Ultra-low 2.5mm (RxxCTE, R05C05TE) or 2.65mm profile (RxxCT)
- Selectable output voltages: 3.3 or 5VDC (RxxCT) or fixed 5V (RxxCTE, R05C05TE)
- Wide operating temperature range: -40°C up to +140°C (RxxCT) or up to +125°C (RxxCTE, R05C05TE)
- 5kVAC/1min reinforced isolation (RxxCT) or 3kVDC/1min basic isolation (RxxCTE, R05C05TE)
- Suitable for medical devices (RxxCT) or COM port isolation, transceiver isolation, and high voltage current sensing (RxxCT, RxxCTE, R05C05TE)
- Meets CISPR32 class B EMC limits
- EN 62368-1 (RxxCT, RxxCTE, R05C05TE) or IEC/EN 60601-1 with 2MOPP (RxxCT)
- Fully-protected with SCP, OCP, OTP, and UVLO
| Series | Power (W) | Vin (V) | Main Vout (V) | Mounting Type | Package Style | |||
|---|---|---|---|---|---|---|---|---|
| 1 |
|
R24C2T25
Focus
New
| 2.5 | 21.0 - 27.0 | SMD | 36-Pin SSOP | ||
| 2 |
|
RxxC05TExxS
Focus
| 0.5 | 5.0 | 5 | SMD | SMD 16 Pin | |
| 3 |
|
RxxC1TFxxS
Focus
New
| 1.0 | 5.0 | 5 | SMD (pinless) | 12 pad LGA | |
| 4 |
|
RxxCTExxS
Focus
| 1.0 | 5.0 | 5 | SMD | SMD 16 Pin | |
| 5 |
|
RxxCTxxS
Focus
| 0.5 | 5.0 | 5 | SMD | SMD 16 Pin | |
| 6 |
|
R12C2T12/R
Coming Soon
| 2.5 | 9.0 - 18.0 | SMD | 36-Pin SSOP | ||
| 7 |
|
R12C2T25/R
Coming Soon
| 2.5 | 9.0 - 18.0 | SMD | 36-Pin SSOP | ||
| 8 |
|
R15C2T25/R
Coming Soon
| 2.5 | 13.5 - 18.0 | SMD | 36-Pin SSOP | ||
| 9 |
|
R24C2T25/R
Coming Soon
| 2.5 | 21.0 - 27.0 | SMD | 36-Pin SSOP | ||
| 10 |
|
R9C1T18/R
Coming Soon
| 3.0 | 8.5 - 18.0 | SMD | 36-Pin SSOP |
| Series | Power (W) | Vin (V) | Main Vout (V) | Mounting Type | Package Style | |||
|---|---|---|---|---|---|---|---|---|
| 1 |
|
R24C2T25
Focus
New
| 2.5 | 21.0 - 27.0 | SMD | 36-Pin SSOP | ||
| 2 |
|
RxxC05TExxS
Focus
| 0.5 | 5.0 | 5 | SMD | SMD 16 Pin | |
| 3 |
|
RxxC1TFxxS
Focus
New
| 1.0 | 5.0 | 5 | SMD (pinless) | 12 pad LGA | |
| 4 |
|
RxxCTExxS
Focus
| 1.0 | 5.0 | 5 | SMD | SMD 16 Pin | |
| 5 |
|
RxxCTxxS
Focus
| 0.5 | 5.0 | 5 | SMD | SMD 16 Pin | |
| 6 |
|
R12C2T12/R
Coming Soon
| 2.5 | 9.0 - 18.0 | SMD | 36-Pin SSOP | ||
| 7 |
|
R12C2T25/R
Coming Soon
| 2.5 | 9.0 - 18.0 | SMD | 36-Pin SSOP | ||
| 8 |
|
R15C2T25/R
Coming Soon
| 2.5 | 13.5 - 18.0 | SMD | 36-Pin SSOP | ||
| 9 |
|
R24C2T25/R
Coming Soon
| 2.5 | 21.0 - 27.0 | SMD | 36-Pin SSOP | ||
| 10 |
|
R9C1T18/R
Coming Soon
| 3.0 | 8.5 - 18.0 | SMD | 36-Pin SSOP |
Order the RECOM evaluation board showcasing latest 3D Power Packaging® technology to permit rapid prototyping or to confirm the performance in the end application.
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