Wide Bandgap Semiconductors (SiC and GaN)
Of course, the first new materials that we should mention are
Silicon Carbide (SiC) and
Gallium Nitride (GaN), two wide bandgap semiconductors that are rapidly replacing silicon in multiple power applications. SiC and GaN power devices operate at higher temperatures and frequencies than Si, allowing for more efficient power conversion in existing designs and even allowing the use of new topologies that are not feasible with silicon devices. Power supplies utilizing these materials can be more compact and lightweight, with improved overall performance. SiC devices are gaining traction in data center high-efficiency rack-mounted designs; GaN is popular for the lower-power designs commonly found in laptop and phone chargers. There is expected to be considerable overlap between SiC and GaN in medium power applications as both materials expand their performance envelope.
Thermal Interface Materials
The effective removal of heat is essential for maintaining the reliability, efficiency, and longevity of electronic components in a power supply. Thermal interface materials are placed between a heat-generating device such as a power transistor and a heat-dissipating device such as a heat sink. They include thermal adhesives, pads, pastes, and gaskets, and are crucial for effective heat dissipation. New materials such as thermal gels with high thermal conductivity and improved thermal resistance properties help in managing the heat generated by power electronic components, enhancing overall reliability and performance.
Looking further ahead, graphene and
carbon nanotubes are being explored for thermal management applications in power supplies. These materials offer excellent thermal conductivity, making them suitable for heat dissipation solutions in
high power density environments.
RECOM Takes Advantage of Material Science Advances
RECOM products take full advantage of upgrades as these material science advancements meet our demanding quality standards and make their way into volume production. Many of the improvements in this area might not be obvious to the customer, manifesting themselves as improvements in efficiency, an extended temperature range, or an increase in reliability.
The new
RKK, for example, is an upgrade to the popular existing
RKE/
RFMM series, a 1W unregulated, isolated, SIP-7 DC/DC. The RKK boasts improved magnetics with a
planar transformerand now has lower EMI, operation to 105°C with no derating, longer lifetime figure, and higher efficiency which is maintained to light loads. Elimination of potting saves cost and weight, nearly halving to just 1.7g, adding to its ‘green’ credentials. An additional new series,
RYK, has a fully linear-regulated output with similar enhancements.
Conclusion
Ongoing research and innovations in materials science continue to shape the evolution of power supply technologies. Advances are occurring on a broad front, benefiting power supplies with improved semiconductor materials, dielectrics, insulators, sustainability, and more.
Incorporating these advanced materials into power supply design contributes to improvements in efficiency, reliability, miniaturization, and sustainability. RECOM designers are constantly evaluating new components that employ new materials and adding them to our designs as appropriate.
