Both architectures aim to minimize power loss. Transmitting power from a power source to a load over a resistive connection, whether it is a wire, bus bar, or PCB trace, incurs power losses in the form of heat, known as distribution losses. The distribution loss for a current is proportional to the square of the current and is given by P = I
2R, where R is the resistance of the wire or bus bar. Reducing it requires either reducing the current or the resistance of the wire.
Reducing the current while delivering the same total power to the load requires increasing the voltage (P = VI). Doubling the voltage from 24V to 48V, for example, reduces the current by 50%, which in turn reduces the distribution loss by 75%. Attempting to achieve the same result by reducing the wire resistance requires quadrupling the conductor cross-section area, which adds weight and cost.
Improved thermal management is another reason to switch to a distributed power architecture. A distributed design spreads the heat-generating elements across the surface area of the equipment to minimize hotspots. Heat is the enemy of electronic components. It has been well established that increased operating temperatures lead to increased failure rates. In some applications, such as the
large-scale LED displays used in sports stadiums or Las Vegas, the effects of excessive heat are noticeable. The light output of an LED declines with increasing junction temperature. Local hotspots can result in LEDs failing faster and appearing dimmer throughout their operating life.