Advanced packaging technologies help Industry 4.0 achieve multiple goals

The history of manufacturing since the 18th century includes four loosely-defined “industrial revolutions” that gradually replaced human and horsepower with increasing levels of mechanization. The first stage of mechanization relied on power from water and steam. In the second stage, there was a move to electrical power and the introduction of mass production and the assembly line, while computers and automation characterized stage three. Each stage enabled greater production flexibility, more efficient use of power, and reduced costs compared to its predecessor.

We’re now well into the fourth stage, often called Industry 4.0. It builds on stage three by adding robotic technologies, massive data-gathering from Internet of Things (IoT) technology, and a cloud-based component that increasingly includes machine learning (ML) and artificial intelligence (AI).

In manufacturing, Industry 4.0 is synonymous with the smart factory, in which automated systems make decisions about local processes, communicate, cooperate with each other, and interact with human operators in real-time, both in the factory and on the cloud.

The factory in Industry 4.0 combines electronic control and monitoring with wired or wireless connectivity in practically every manufacturing process. In many cases, this requires fitting electronic modules into small spaces that were never designed for that purpose, so extremely compact electronic modules are a must.


For example, installing a network of remote sensors to gather data for transmission to a central hub is a typical Industry 4.0 application. The space available for these sensor modules is often very limited. Unfortunately, the power management design tends to be one of the larger circuit blocks since it requires a diverse range of bulky components, such as power transistors, transformers, capacitors, and inductors. Power designers always search for new ways to improve efficiency, decrease manufacturing costs, and boost power density by packing more power into a smaller space.

For low-power isolated DC/DC converters and switching regulators, designers must satisfy the demand for better performance and improved power density while still developing a cost-effective solution.

In the sensor design discussed above, adding long cables throughout the factory is often not feasible, especially if Industry 4.0 features are being added to an existing installation. Consequently, many sensor modules rely on battery power and wireless communication, such as WLAN, Bluetooth Low Energy (BLE), or LoRa.

Therefore, highly efficient power solutions with very low standby current consumption are essential for maximizing battery life. The drive toward higher efficiency has spurred the development of DC/DC converters that use sophisticated topologies, such as push-pull configurations and synchronous rectification. Industrial applications must have a long operating life, so the life expectancy of the power supply must not be a limiting factor.

Advanced packaging technology can help achieve key Industry 4.0 goals

Advanced packaging technology for DC/DC converters can help improve efficiency, reduce size, and even reduce cost.

The desire for more compact power supplies has led to devices that integrate the transformer, control device, power transistors, and other components into a single package.

However, the footprint must remain small to realize the advantages of a module over a discrete design. To achieve this, non-isolated DC/DC switching regulators and isolated converter modules utilize the z-direction by integrating 3D assembly techniques for minimum footprint and maximum power density. Internally, the device mounts a low-cost flip chip on a lead frame and adds an integrated inductor with over-molding.

The 3D construction also lends itself to increased efficiency: The components are situated in extremely close proximity to each other, resulting in tight switching current loops that generate very low EMI, along with high power density and optimized thermal performance that exceeds that of discrete designs.

So far, so good. But in the quest for ever-higher product reliability at lower cost, modern electronic manufacturing lines are moving toward eliminating hand assembly, including hand soldering, wherever possible. The two standard automated soldering operations—wave and reflow—require components that use surface-mount technology (SMT) packaging. Almost all electronic components, such as data converters, microcontrollers, and passives, are available in this format. Traditionally though, through-hole SIP packages are often used for integrated DC/DC converters because they minimize the PCB footprint, even though they can complicate the assembly by requiring an additional hand-soldering step that is a potential source of error.

RECOM products simplify automated production flows

RECOM offers a range of isolated and non-isolated DC/DC converters in SMT packages that are ideal for Industry 4.0 applications. These low-power DC/DC converters can be handled, placed, and soldered like any other SMT component. Additionally, they have a low profile to match today’s slim-line products.

The RPX-0.5Q is an automotive-grade buck converter with an integrated shielded inductor in a compact 3mm x 5mm x 1.6mm thermally enhanced QFN package with wettable flanks that allow automated optical inspection of solder joints. The input range is from 4 to 36VDC, allowing 5V, 12V, or 24V supply voltages to be used. The output voltage can be set from 0.8 up to 34VDC, selected by two external resistors. The output current is up to 0.5A, and the device is fully protected against continuous short circuits, output over-current, or over-temperature faults.

In the isolated product line, the R05C05TE05S is a cost-efficient, low profile, 0.5W SMD isolated DC/DC single output converter with a 4.5–5.5V input range and a semi-regulated 5V output. There is no minimum load requirement, which is ideal for applications that switch into very light load operation modes. The device is also able to deliver up to 600mW for applications requiring additional power for short-peak operation modes. Standard isolation is 3kVDC/1min, and the operating temperature ranges from -40°C up to +125°C with derating. The fully automated design is equipped with short-circuit, over-current, and over-temperature protection to ensure the highest reliability in applications such as communication, current sensing, and COM port isolation.

Conclusion

Industry 4.0 imposes stringent reliability, size, and efficiency requirements on DC/DC converters. RECOM’s low-power isolated and non-isolated DC/DC converters use advanced packaging technology that improves product reliability, lowers cost, and helps boost efficiency—all in best-in-class package sizes.