Power Supply Meets EMC: Essential Testing, Design, and Protection

EMC 챔버
In this whitepaper we give a short introduction to basic EMC knowledge and which EMC considerations are key in designing power supplies. The shown EMC tests can trace the most common failure causes.

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Introduction

The main purpose of this document is to introduce the fundamental principles of Electro-Magnetic Compatibility (EMC) requirements and relate this knowledge to the topic of power supplies. The first part addresses the principles and definitions of EMC. Additionally, it covers the main test procedures—beyond radiated and conducted emissions that are essential for EMC. This section aims to raise awareness of the wide range of EMC test procedures.

The second part delves into coupling mechanisms, which are typically included in most EMC presentations. The information in this section applies to all EMC-related issues. When discussing power supplies and EMC, it is essential to mention the protective devices required to combat transient disturbances. The third part highlights these protective devices, with a special focus on their proper placement.

The fourth part explores the EMC-focused designs of three different DC/DC converters. By explaining the individual measures, this section connects directly to the second part. The final section of this document shares practical insights on identifying the noise source and starting the design process with EMC in mind. It provides not only guidance on how to address design failures but also outlines steps to ensure a successful first-time pass.

Principles

Principles
Fig. 1: Principles
Every electrical device emits and receives electromagnetic disturbances. As a result, most devices function as both sources and sinks, as illustrated in Figure 1. However, depending on their design and function, some devices are more likely to act as significant sources of disturbance, while others are more prone to be sinks. For instance, a pacemaker is more likely to be a disturbance sink than a source.

Every electrical device emits and receives electromagnetic disturbances. As a result, most devices function as both sources and sinks, as illustrated in Figure 1. However, depending on their design and function, some devices are more likely to act as significant sources of disturbance, while others are more prone to be sinks. For instance, a pacemaker is more likely to be a disturbance sink than a source.

The second way a disturbance can travel is through a wire, metal sheet, or any other conductive material. As with radiated emissions, several types of disturbances can occur.

In addition to frequency-dependent disturbances, we also test transient disturbances, such as surge, burst, and Electro-Static Discharge (ESD), which can be particularly critical (e.g., according to EN 55022).

EMC Directive: Compliance and Testing Requirements

Die Definition der elektromagnetischen Verträglichkeit (EMV) gemäß der aktuellen europäischen EMV-Richtlinie 2014/30/EU verlangt, dass ein Gerät in seiner elektromagnetischen Umgebung einwandfrei funktioniert, ohne unzulässige elektromagnetische Störungen in andere Geräte einzubringen oder durch die von diesen erzeugten elektromagnetischen Beeinflussungen (EMI) gestört zu werden. Die Richtlinie umfasst sowohl gestrahlte Emissionen und Störfestigkeit (elektromagnetische Felder) als auch leitungsgebundene Emissionen und Störfestigkeit (Störungen entlang von Kabeln). Zusätzlich fordert die Richtlinie, dass Emissionsprüfungen im Betriebsmodus durchgeführt werden, in dem die meisten Störungen zu erwarten sind, während Störfestigkeitsprüfungen in dem Modus erfolgen müssen, in dem das Gerät gegenüber externen Störungen am empfindlichsten ist.

Typical EMC Tests

When considering EMC tests or issues, radiated and conducted emissions often come to mind. However, there are several other factors to consider. Experience has shown, though, that conducted and radiated emission tests are typically the most critical tests engineers must address.

Conducted emission

The measurement of disturbing voltage in the lower frequency range between 9kHz and 30MHz on the lines connected to or leaving the device is called conducted emission. The purpose of this measurement is to prevent interference between devices connected via cables or other common conductive paths. If the emission from the tested device stays below the limit, it is unlikely to cause disturbances to other equipment.

Radiated emission

The measurement of disturbing electrical fields above 30MHz is called radiated emission. Like conducted emission measurements, this test is typically set up according to the Comité international spécial des perturbations radioélectriques (CISPR) standard number 16. The limits applied are based on the specific CISPR standard; for example, CISPR 11 applies to industrial, scientific, and medical equipment, while CISPR 14 applies to household appliances and electric tools. This measurement determines whether the emitted electromagnetic waves from the tested device are likely to disturb nearby electrical equipment.

ESD

Another critical test involves transients, such as Electro-Static Discharge (ESD). In the ESD test, a pulse with a specific shape is applied to the device’s conductive parts, nearby conductive metal parts at a specified distance, or even non-conductive but touchable parts. These pulses typically generate electric fields and high currents over a very short period, which can cause interruptions, shutdowns, resets, or other undesirable behaviors. Therefore, the device must be designed to withstand these electromagnetic phenomena. Different test levels apply depending on the typical environment in which the device operates, unless otherwise specified in a particular standard. The ESD pulse is quite high (up to ±15 kV) and very fast (in the nanosecond range). Due to the rapid nature of the pulse, both direct and indirect, this test is considered one of the most critical EMC tests.

Surge

The surge test applies a pulse with a specific shape through galvanic coupling onto the lines of the tested device. Its purpose is to assess the device's robustness against indirect lightning strikes. Unless otherwise specified, the test levels must be applied based on the environment in which the device is used. The surge test pulse is not very high (up to ±4kV) and is very slow (in the microsecond range), which results in a large amount of dissipated energy. This high energy is the critical factor in the test, as it can easily damage the device.

Burst

The burst test combines properties of both the surge and ESD tests. The pulse itself is very fast (in the nanosecond range) like the ESD pulse, but it is much lower in voltage (up to ±4kV) like the surge pulse. However, this pulse is repeated at fixed intervals. The burst test simulates the brush sparking of a motor. Even though the pulse is fast with a rise time in the nanosecond range, the coupling is capacitive, meaning the device does not need to drain the current directly. This makes it the least harmful of the transient tests.

Harmonics

The harmonics test is one of the most important tests for power supply distributors. This measurement determines whether harmonic distortion is superimposed onto the fundamental frequency of 50Hz.

Flicker

A device that consumes very high energy for short periods can cause voltage dips, which may lead to problems for other devices connected to the same main power line. If this occurs too frequently or with too much intensity, or if the impact is too high, the device will fail the flicker test. This test is particularly critical for devices that switch high energy in short intervals. The pass or fail criteria are determined empirically and depend on the magnitude of the voltage drop and the frequency of the event. A small voltage drop can occur many times per second, but if the drop is large, it is only allowed to happen at a very low frequency.

E-field immunity

The e-field immunity test complements the radiated emission test. In this test, the device is evaluated for its immunity against external electrical fields generated by other electrical equipment. The test is typically conducted within a frequency range of 80MHz to several GHz, depending on the applicable standard. The applied field is an amplitude-modulated signal with 80% modulation at 1kHz.

HF-induced disturbances

In this test, high-frequency disturbances are introduced to the lines connected to the device. The purpose is to assess the device’s robustness against external disturbances caused by other equipment connected to the same electrical system. The HF-induced disturbance test is often considered an important complement to conducted emission tests.

Voltage dips, variations, and interruptions

This test examines how a device responds when the main power supply voltage fluctuates. It consists of three parts, each addressing different types of voltage variations. The response criteria, which define how the device should behave in response to voltage fluctuations, must be selected. Depending on the device's application, it may be acceptable for the device to shut off during a voltage fluctuation, or it may be required to remain operational despite such fluctuations. Voltage dips are tested to assess the impact of a sudden voltage drop on the device.

Magnetic power field

The magnetic power field test simulates a homogeneous magnetic field at the frequency of the main power supply (50Hz or 60Hz). When placed in such a magnetic field, typically produced by a Helmholtz coil, the device must operate properly. Devices, such as cathode ray tube (CRT) monitors, were particularly affected by this test.

Types of Coupling

Coupling Mechanism
Fig. 2: Coupling Mechanism
The following figure shows a model where Rk, Ck, and Zk represent parasitic elements responsible for coupling in a circuit. Galvanic coupling is depicted by the resistor Rk. Parasitic capacitive coupling is represented by the parasitic capacitance Ck. Parasitic inductive coupling is represented by the parasitic elements Zk.

The only coupling mechanism not pictured in Figure 2 is the airborne coupling since it cannot be sketched through parasitic elements.

Galvanic coupling

Galvanic Coupling
Fig. 3: Galvanic Coupling
Figure 3 shows a circuit branch with an additional noise signal represented by a resistive value. The noisy current in the circuit generates a noisy voltage on the parasitic resistive trace, which in turn affects the voltage on the resistive load. In this case, an ideal source can become a noisy source due to the added noise on a common branch.

Measures to reduce coupling interference

This type of coupling can be reduced by decreasing the impedance, and thus the common resistive path, between the two circuits. The effect on the voltage of the resistive load is directly proportional to the impedance of the common trace.

If the location and source of the noise are known, the noise current can be reduced. This can be achieved by addressing the noise directly at the source, using a filter to reduce the noise along its path to the jamming sink, or by lowering the frequency of the noise. The impedance of the common trace is directly proportional to the frequency of the noise, as impedance is a frequency-dependent value. The frequency in a system should be as fast as necessary and as slow as possible.

To avoid a common trace, a star-point topology can be used to separate the noisy parts from the load circuit. The ground systems are connected at a single point. To minimize uncontrollable coupling, both the return path and the forward path should be considered during layout design. As the design typically includes several forward and return paths, each path should be prioritized and categorized as aggressive, sensitive, or indifferent. The most aggressive loop, which has the highest di/dt, should be made as small as possible and given the highest priority among aggressive traces.

Capacitive coupling

Capacitive Coupling
Fig. 4: Capacitive Coupling
The parasitic element Ck in Figure 4 exists in circuitry between adjacent parallel wires. Through this capacitance, which is typically very low, high-frequency (HF) signals may couple to other components, potentially causing problems.

Measures to reduce capacitive coupling:

  1. Short traces are one countermeasure against capacitive coupling, as the length of the trace is directly proportional to the coupling between conductive parts. Traces running parallel over long distances are more susceptible to capacitive coupling, which can become problematic (for example, in an analog measurement line running parallel to a clock line).
  2. Additional capacitors can create symmetry for highly sensitive signals, allowing the noise to be coupled back early before it causes issues.
  3. Capacitive coupling can be reduced by shielding with conductive materials.
  4. Capacitive coupling can also be minimized by lowering the frequency.
  5. When cables are run over long distances, twisted pairs (possibly shielded) are particularly effective at preventing unwanted coupling.

Inductive coupling

Inductive Coupling
Fig. 5: Inductive Coupling
Live wires can be inductively coupled through magnetic fields. These fields can couple into nearby metal parts, including sensitive traces, and induce current.

Measures to reduce inductive coupling:

  1. As with capacitive coupling, traces carrying different signals should not be designed in parallel, as live wires in parallel can induce current in one another.
  2. Large loops in noisy circuits generate significant magnetic fields, so the most critical loops with the highest di/dt should be kept as small as possible. Additionally, highly sensitive loops should also be minimized, as circuits with larger loops are more prone to disturbances.
  3. To design small loops, the designer must always consider the return path.
  4. Traces are less sensitive to frequencies when the loops (and thus the impedances) are small.
  5. As the frequency decreases, inductive coupling also reduces. A design should use a frequency that is as slow as necessary but as fast as possible.
  6. Magnetic fields can also be shielded using non-conductive materials such as permalloy and µ-metal, commonly found in RFID and NFC applications.
  7. Ferrite plates can also be used on controllers to shield magnetic fields.

Airborne coupling

Radiated emission measurement is a form of airborne coupling. If the measured emission is very high, there is a high level of coupling between the Equipment Under Test (EUT) and the antenna. Since the antenna should remain unchanged, the coupling can only be reduced by shielding the device or lowering the noise level generated by the device. There are two types of measurements for radiated emission. Typically, radiated emissions are measured in µV/m, and normal metal shielding is sufficient. However, when measuring according to CISPR 11 for Group 2 devices, the H-field is also measured in µA/m.

Depending on the size of the device under test and the length of the cables, the emission is usually quite high, typically at λ/4 of the wavelength. In most cases, the cables act as an antenna, with the source located on the board. Emission starts at around λ/10 of the wavelength. To reduce radiated emission, shielded cables or filtering before the cabling can be used. In any case, all outgoing and incoming signals should be filtered. Radiated emission also decreases at lower frequencies, which in turn reduces the airborne coupling between the device and the antenna.

Protective Elements for Power Supply

Protective circuitry is one of the most critical subsystems for AC/DC converters. These components are essential for safeguarding the device against surge, burst, and ESD events.

There are several possibilities to protect the device:

  1. 1Spark air gaps, which can dissipate most of the additional energy
  2. Gas discharge tubes
  3. Varistors
  4. Series resistor
  5. MLV (Multilayer Varistor)
  6. TVS
  7. Filter
For protecting ICs with smaller amplitudes, a suppressor diode or Zener diode is typically the best solution.

All these protective elements are essential to consider, as each device operates within a specific voltage and energy range. For power supplies, two or even three elements are often used, as energy pulses can be very high. An element that can handle higher energy also allows a significantly high voltage to pass. For example, the spark air gap can absorb the highest energy but is unable to reduce the voltage to a safe level. The gas discharge tube can absorb less energy but will lower the voltage more than the spark air gap. The same applies to varistors, diodes, and similar components.

This leads to the optimal placement shown in Figure 6. The current first passes ...

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