Since SiC and GaN aren’t mature technologies like silicon, standards are still changing as manufacturers improve performance with each successive generation. For example, first, second, and third generation SiC devices are available on the market from different manufacturers and each generation has a different voltage combination needed to turn the device on and off.
This presents a problem for both the gate drivers and for the isolated DC/DC converters used to supply power to the gate drivers. These DC/DC converters typically use an internal transformer to provide isolation. The transformer is designed with a fixed ratio to supply the bias voltage appropriate for the gate driver being used.
As a result, one DC/DC converter is needed to supply one SiC device with turn-on and turn-off voltages of +15V and -8V; a different converter is needed to supply another SiC device with voltages of +15V and -3V. If both combinations are available as standard products that isn’t a problem, but if a new DC/DC converter design is needed, the schedule may be impacted, and safety recertification may be required. The unit cost is also likely to increase due to lower production volumes.
This presents a problem for both the gate drivers and for the isolated DC/DC converters used to supply power to the gate drivers. These DC/DC converters typically use an internal transformer to provide isolation. The transformer is designed with a fixed ratio to supply the bias voltage appropriate for the gate driver being used.
As a result, one DC/DC converter is needed to supply one SiC device with turn-on and turn-off voltages of +15V and -8V; a different converter is needed to supply another SiC device with voltages of +15V and -3V. If both combinations are available as standard products that isn’t a problem, but if a new DC/DC converter design is needed, the schedule may be impacted, and safety recertification may be required. The unit cost is also likely to increase due to lower production volumes.