RVPW011-FJ1-CT

  • 输入电压5V～50V 超宽范围
  • 适用于原边反馈反激式变换器
  • 最小采样时间低至0.4μS
  • 重载下工作于边界导通模式
  • 轻载条件下降低工作频率以提升效率
  • 集成90V/40mΩ LDMOS
  • 集成无损电流采样
  • 可编程峰值电流
  • 可编程功率 MOSFET 驱动速度
  • 可编程前馈补偿
  • 可编程软启动
  • 可编程输入欠压及过压保护
  • 短路保护、过温保护
  • 内置环路补偿
  • 使能关断时电流小于 0.1μA
  • 输出二极管压降温度补偿
  • QFN5x5 强散热封装

RVPW011 是一款反激式变换器，通过对变压器原边绕组进行采样实现稳压，在数百 kHz 的工作频率下支持原边反馈（PSR） 控制。其内置的输出电压采样电路可支持窄至 400ns 的采样电压脉冲。芯片集成内部环路补偿电路，具备快速动态响应能力，可为开关电源提供优异的系统稳定性与动态性能。

RVPW011 专为低压工作场景设计，最低支持 5V 输入电压，内置导通电阻仅为 40mΩ 的低内阻 MOSFET。搭配散热性能优异的 5mm×5mm QFN 封装，该器件可提供最高 30W 的输出功率。

RVPW011 集成多种控制功能，所需外围元器件极少，设计人员可根据具体应用需求对系统进行定制配置。芯片可通过外接电阻实现启动、前馈补偿以及内部功率 MOSFET 关断速度的调节；功率 MOSFET 的峰值电流也可通过电阻可编程设定，并支持无损电流采样。输入欠压与过压保护阈值可通过两颗电阻同时设定，软启动时间则可通过外接电容可编程调节，从而根据应用场景优化系统性能。

为确保系统稳定可靠运行，RVPW011 内置多重保护功能，包括过载保护、输出短路保护、输出过压保护及过温保护。所有保护机制在故障解除后均支持自动恢复，最大限度提升整个电源系统的可靠性与稳定性。

IC 与变压器组合方案，板载 / 分立器件任意选

  产品编号 功率（W） 隔离电压 (kV) 输入电压（V） 主输出电压（V） 原边 IC 变压器 副边 IC
1
新
6 6 16 - 32 2.5 ‐ 4
特性 RVPW011-FJ1-CT
Product Category IC
输入电压（V） 5 - 50
主输出电压（V） 2 ‐ 999
输出电压范围（V） 2 - 999
MAX Iout (mA) 10
安装类型 SMD (无引脚）
封装类型 QFN5x5
长度 (mm) 5.1
宽度 (mm) 5.1
高度 (mm) 0.8
最低工作温度 (°C) -40
最高工作温度 (°C) 125
保护功能 OCP, OTP, OVP
指令 Halogen-free, REACH, RoHS 2+ (10/10)
包装类型 防潮袋
工作模式 Current Mode
质保 1 Year
Config 1 Channel
拓扑结构 Flyback
Number of Phases 1
Functional Features Enable, Soft Start, Variable Switching Frequency
MIN Switching Frequency (kHz) 9
MAX Switching Frequency (kHz) 330
MIN Storage Temperature (°C) -55
MAX Storage Temperature (°C) 150
Important parameters include input voltage range, output voltage, maximum load current, switching frequency, efficiency, size, and thermal performance. Selection involves balancing these factors to meet the specific requirements of your application, ensuring the IC operates within its safe thermal and electrical limits while minimizing PCB space.
A boost converter increases the input voltage to a higher output voltage using an inductor, low-side switch, a rectifier, and output filter.
A buck converter reduces the input voltage to a lower output voltage using a high-frequency high-side or low-side switch, an inductor, a rectifier, and output filtering.
A buck‑boost converter can both increase and decrease the output voltage in relation to the input voltage using one or more inductors, a high-side or a low-side switch, rectifiers, and output filtering.
A DC/DC controller IC manages the switching behavior of external power components such as MOSFETs, inductors, and transformers.
A DC/DC converter IC converts one DC voltage level to another using switching techniques and integrated control circuitry.
A synchronous converter replaces the traditional rectifier diode with a MOSFET, which reduces conduction losses and significantly improves efficiency.
An asynchronous converter uses a diode as the rectification element, resulting in a simpler design but typically lower efficiency compared to synchronous alternatives.
A converter IC typically integrates the power switches internally, providing a more compact solution. In contrast, a controller IC manages the switching behavior of external power components such as MOSFETs, inductors, and transformers.
Buck-boost converters are commonly used when the input voltage can vary above and below the desired output voltage. For example, this topology is ideal for maintaining a 12V fixed voltage from a 12V battery supply, where the battery level may fluctuate during discharge or charging.
Push-pull and full bridge topologies are often unregulated, making them best suited for use with regulated input voltage rails. Push-pull is preferred for 3.3V and 5V input voltage rails because the input current is shared between the switching transistors, allowing more power to be extracted from a smaller IC package. Full Bridge is preferred for 5V up to 24V input voltage rails because the input voltage stress is shared between the switching transistors, enabling it to efficiently switch higher input voltages. For regulated output voltages, wider input voltage ranges, or higher output power applications, Flyback is the preferred topology due to its versatility and ability to provide galvanic isolation.
Power ICs enable efficient switching topologies, optimized control algorithms, and fast switching frequencies that minimize power losses.
Key advantages include high integration, a small footprint, and improved efficiency. Integrated power ICs allow designers to create optimized power solutions tailored specifically for unique applications.
Power ICs typically require more external components and careful PCB design. This requirement for additional external parts and complex layout increases overall development complexity.
Common types include DC/DC converter ICs, PWM controller ICs, gate driver ICs, PMICs, linear regulators, and battery management ICs.
Power ICs are used in industrial electronics, telecom systems, consumer electronics, automotive systems, and IoT devices.
A power IC (power integrated circuit) is a semiconductor device designed to regulate or convert electrical power. It integrates essential functions such as feedback regulation, switching control, protection, and power management into a single chip.
A PMIC is an integrated circuit designed to manage power distribution within complex electronic systems. It typically integrates multiple voltage regulators, power sequencing, battery management, and system monitoring functions into a single semiconductor device.
A power IC is a semiconductor controller chip that requires external magnetic components such as inductors or transformers but often includes integrated power switching transistors. A power module integrates many of these discrete components into a single packaged solution, simplifying PCB design and reducing overall development time.
Power switching transistors differ primarily in how they are controlled, their switching speed, maximum switching voltage, and their power-handling limits. The main types include MOSFETs (up to 100kHz, 600V, 1kW), SiCs (up to 500kHz, 3.3kV, 100kW), GaNs (up to 1MHz, 900V, 10kW), and IGBTs (up to 50kHz, 6.5kV, 1MW).

MOSFETs are most often used in switching power supplies due to their low cost and ease of integration. SiCs and GaNs are utilized for high-frequency switching applications, while IGBTs are preferred for very high power or high-voltage switching.
Power ICs are often utilized when designers require maximum flexibility, lower cost at high volumes, or highly customized power architectures.

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