RECOM 的表面贴装型非隔离式开关稳压器提供 QFN、鸥翼形和 LGA 封装，额定电流范围为 0.5 A 至 6 A，输出电压可固定也可调，范围为 0.6 V 至 24 V。根据不同的型号，输入电压最高可达 60 V，最低可至 2.3 V。产品采用 RECOM 先进“3D 电源封装®”技术，功率密度高于同类产品，同时在较高环境温度下可保持高效运行。
High-Performance SMD Switching Regulators
0.5–20A
| 系列 | 电流(A) | 输入电压（V） | 主输出电压（V） | 安装类型 | 封装类型 | |||||
|---|---|---|---|---|---|---|---|---|---|---|
| 1 |
|
ROF-78K-0.5
重点
新
| 0.5 | 4.5 - 36, 6.5 - 36, 8 - 36, 11 - 36, 15 - 36, 18 - 36, 28 - 36 | 12, 15, 24, 3.3, 5, 6.5, 9 | SMD (无引脚） | 开放式 | |||
| 2 |
|
RPMH-0.5
重点
| 0.5 | 4.3 - 65, 6 - 65, 13.5 - 65, 16.5 - 65, 25.5 - 65 | 15 ‐ 28, 2.64 ‐ 3.63, 4 ‐ 5.5, 7.2 ‐ 13.2, 9 ‐ 16.5 | SMD (无引脚） | 25 pad LGA | |||
| 3 |
|
RPMVH-0.5
重点
新
| 0.5 | 6 - 115, 7.5 - 115, 14.5 - 115, 28 - 115 | 15 ‐ 28, 2.64 ‐ 3.63, 4 ‐ 5.5, 7.2 ‐ 13.2 | SMD (无引脚） | 25 pad LGA | |||
| 4 |
|
RPZ-0.5
重点
| 0.5 | 2.3 - 5.5 | 0.6 ‐ 5.375 | SMD (无引脚） | 10-Pad QFN | |||
| 5 |
|
RPL-1.0
重点
| 1 | 3 - 22 | 0.6 ‐ 12 | SMD (无引脚） | 11 pad LGA | |||
| 6 |
|
RPM-1.0
重点
| 1 | 3 - 17 | 0.9 ‐ 6 | SMD (无引脚） | 25 pad LGA | |||
| 7 |
|
RPX-1.0
重点
| 1 | 4 - 36 | 0.8 ‐ 30 | SMD (无引脚） | QFN | |||
| 8 |
|
RPZ-1.0
重点
| 1 | 2.3 - 5.5 | 0.6 ‐ 5.25 | SMD (无引脚） | 10-Pad QFN | |||
| 9 |
|
RPMH-1.5
重点
| 1.5 | 5 - 60, 7 - 60, 14 - 60, 17 - 60, 26 - 60 | 15 ‐ 28, 2.64 ‐ 3.63, 4 ‐ 5.5, 7.2 ‐ 13.2, 9 ‐ 16.5 | SMD (无引脚） | 25 pad LGA | |||
| 10 |
|
RPX-1.5
重点
| 1.5 | 4 - 36 | 0.8 ‐ 30 | SMD (无引脚） | QFN | |||
| 11 |
|
RPX-1.5Q
重点
| 1.5 | 4 - 36 | 0.8 ‐ 30 | SMD (无引脚） | QFN | |||
| 12 |
|
RPM-2.0
重点
| 2 | 3 - 17 | 0.9 ‐ 6 | SMD (无引脚） | 25 pad LGA | |||
| 13 |
|
RPMB-2.0
重点
| 2 | 4 - 36, 5.5 - 36, 12.8 - 36, 16 - 36 | 1 ‐ 9, 9 ‐ 24 | SMD (无引脚） | 25 pad LGA | |||
| 14 |
|
RPZ-2.0
重点
| 2 | 2.75 - 6 | 0.6 ‐ 5.74 | SMD (无引脚） | 18-Pad QFN | |||
| 15 |
|
RPX-2.5
重点
| 2.5 | 4.5 - 28 | 1.2 ‐ 6 | SMD (无引脚） | QFN | |||
| 16 |
|
RPH-3.0
重点
| 3 | 4.5 - 55 | 1 ‐ 15 | SMD (无引脚） | 47-Pad QFN | |||
| 17 |
|
RPL-3.0
重点
| 3 | 4 - 18 | 0.8 ‐ 5.2 | SMD (无引脚） | 10 pad LGA | |||
| 18 |
|
RPM-3.0
重点
| 3 | 3 - 17 | 0.9 ‐ 6 | SMD (无引脚） | 25 pad LGA | |||
| 19 |
|
RPMB-3.0
重点
| 3 | 4 - 36, 5.5 - 36, 12.8 - 36, 16 - 36 | 1 ‐ 9, 9 ‐ 24 | SMD (无引脚） | 25 pad LGA | |||
| 20 |
|
RPZ-3.0A
重点
| 3 | 2.75 - 6 | 0.6 ‐ 5.5 | SMD (无引脚） | 18-Pad QFN | |||
| 21 |
|
RPX-4.0
重点
| 4 | 3.8 - 36 | 1 ‐ 7 | SMD (无引脚） | QFN | |||
| 22 |
|
RPMA-4.5
重点
| 4.5 | 9 - 53 | 5 ‐ 30 | THT | 开放框架式1/32砖 | |||
| 23 |
|
RPL-5.0
重点
| 5 | 2.75 - 17 | 0.6 ‐ 12 | SMD (无引脚） | 24-Pad QFN | |||
| 24 |
|
RPM-6.0
重点
| 6 | 4 - 15 | 0.9 ‐ 6 | SMD (无引脚） | 25 pad LGA | |||
| 25 |
|
RPZ-6.0
重点
| 6 | 2.75 - 7 | 0.6 ‐ 6.65 | SMD (无引脚） | 24-Pad QFN | |||
| 26 |
|
RPMA-8.0
重点
| 8 | 9 - 53 | 3.3 ‐ 16.5 | THT | 开放框架式1/32砖 | |||
| 27 |
|
RPL-10
重点
| 10 | 4 - 16 | 0.6 ‐ 5.5 | SMD (无引脚） | 29 pad LGA | |||
| 28 |
|
RPL-20
重点
| 20 | 4 - 16 | 0.6 ‐ 5.5 | SMD (无引脚） | 29 pad LGA | |||
| 29 |
|
REH
| 0.05 - 5 | 1.71 ‐ 3.47 / 1.8 | SMD (无引脚） | 25 pad LGA | ||||
| 30 |
|
R-78AA-0.5
| 0.5 | 4.75 - 30, 4.75 - 32, 6.5 - 32, 8 - 32, 11 - 32, 15 - 32, 18 - 32 | 1.5, 1.5 ‐ 3, 15, 3 ‐ 5.5, 3 ‐ 8, 3.3 ‐ 11, 4.5 ‐ 12.6 | SMD | SMD 10 引脚 | |||
| 31 |
|
ROF-78E-0.5
| 0.5 | 5 - 36, 9 - 36, 15 - 36 | 12, 3.3, 5 | SMD | 开放式 | |||
| 32 |
|
R-78AA-1.0
| 1 | 4.75 - 18, 6.5 - 18 | 1.5, 1.5 ‐ 3, 3 ‐ 5.5 | SMD | SMD 10 引脚 | |||
| 33 |
|
R-78T-1.0
| 1 | 7 - 42, 8 - 42, 15 - 42 | 12, 3.3, 5 | SMD | 开放式 | |||
| 34 |
|
RBB10-2.0
| 4 | 2.3 - 5.5 | 1 ‐ 5.5 | SMD (无引脚） | 25 pad LGA |
Frequently Asked Questions
SMD switching regulators are used to efficiently step down or regulate voltage in compact electronic systems where space, efficiency, and thermal performance are critical, such as embedded systems, IoT devices, and industrial electronics.
Compared to through-hole modules, SMD regulators offer a significantly smaller footprint and higher power density. Their low-profile design allows for easier integration directly onto high-density PCBs, making them the industry standard for modern, miniaturized hardware designs.
RECOM provides a variety of surface mount options to fit different PCB layouts, including QFN (Quad Flat No-leads), gull-wing, and LGA (Land Grid Array) package styles. These options offer engineers flexibility for different assembly requirements and thermal profiles.
Yes. By utilizing advanced 3D power packaging techniques, our regulators maximize heat dissipation and maintain high efficiency. This ensures stable, reliable operation even in elevated temperature environments common in industrial and automotive applications.